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Lamination Plates
Lamination Pads
Pre-Laid Magnetics
Hi-Bond™ Adhesive
Consumable products for
the production of ISO,
credit and smart cards
A unique range of micromodule adhesives
for smart cards
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Specifically developed for implanting micromodules into a range of card materials
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Optimal bond strength for PVC, ABS (and blends),
Polyester and Polycarbonate smart cards
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Rapid reaction speed ensuring high throughput
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Available for FR4 and new generation FCOS™ (flipchip) micromodule implantation
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Fully compatible with all major micromodule implantation machines
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Up to two year shelf life under normal storage conditions
