cardel
       
Lamination Plates
High Security Lamination Plates
Lamination Pads  
Pre-laid Magnetics  
Hi-Bond Adhesive  
x Hi-Bond   Hi-Bond™ "P"
x Cardmate   Cardmate™


Hi Bond(TM)
Consumable products for
the production of ISO,
credit and smart cards

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 


Hi Bond(TM) Micromodule Adhesives


As Passports become widely electronic - ePassports - they now incorporate chips and antennas plus other security features. The bonding adhesives used to construct these increasingly sophisticated passports must be able to meet the demands for security, durability and protection of the enclosed electronic features. The HiBond "P" range of security adhesive films provide a unique bonding solution for ePassport production. The features include:

 

 
Bonding – High bonding performance between ePassport layers for maximum security.
Durability – a durable bond conforming to the highest standards of bonding and peel strength with full "washing" resistance.
Flexibility – highly flexible interface layer retaining flexibility over time and repeated mechanical stressing – resistant to stress cracking.
Encapsulation properties – ability to encapsulate the antenna and chip structure inside the ePassport providing extra protection.
Stress absorption/cushioning – an adhesive film retaining compliance and resilience and with a good recovery properties under compression.
Available pre-coated onto passport materials – Teslin, cover materials, polycarbonate, shielding layers.
 
  e-passport    
 
HiBond 101 – high performance film adhesive with lamination/bonding temperature similar to Polycarbonate – with high heat resistance – designed for use in passport data page constructions and similar applications.

HiBond 80-1 – formulated to provide a secure bond in passport covers – particularly between synthetic based inlays (eg.Teslin) and the passport cover.

  The HiBond “P” range  
 

The above are now being supplied precoated to materials such as Teslin – for handling, convenience and reduction of processing – in the case of Teslin this can allow processing as normal with the dry film adhesive on one or both sides – which can then be directly bonded into the passport structure during lamination.

  The pre-coated HiBond "P" range  
  Adhesive film   Options are available for coating HiBond “P” adhesives onto other passport materials including covers materials and “shielding” foils.  
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